MICROLITHOGRAPHIC POLYMER FILM

 High performance &High resolution Multi-Purpose polymerf film

 for Wafer Bumping,and Copper Pillar Application.

MPF Product Features/ Application
•Negative working, aqueous processable polymer film
•Three layer package
•Suitable for in-via and mushroom electroplating bumping applications.
•Suitable for photo stenciling applications.
•Strong heat resistance.
•High resolution capability.
•Wide processing latitude.
•WLP series is compatible with the following typical surfaces:Silicon
Silicon Nitride Sputtered copper Sputtered gold PI/BCB with UBM
•Polymer film thickness:  75, 100 , 120 and 160 microns